Menu
ORDER ONLINE - no minimum order value
AGENTS & DISTRIBUTORS - available worldwide
REQUEST QUOTES - fast online pricing

Omniprobe lift-out grids are specifically designed to accept TEM lamellae milled by FIB or SEM/FIB systems. The grids are 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an un-obscured view of each section. All grids are 3mm diameter.

Filters

4 products available

You've viewed 4 of 4 products

  1. Beryllium half-ring lift-out grids. Pack of 10 AGJ425
    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.
    Average lead time: 23 days
    £873.59
    Average lead time: 23 days
    Down
    Up
  2. 3 post lift-out grids
    3 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 to 14 days

    From £292.02

    Average lead time: 1 to 14 days
  3. 4 post lift-out grids
    4 post lift-out grids designed for in situ lift-out.
    Average lead time: 23 to 38 days

    From £305.29

    Average lead time: 23 to 38 days
  4. 5 post lift-out grids, copper. Box of 100 AGJ422
    5 post copper lift-out grids are suitable for in situ lift-out. Copper
    Average lead time: 23 days
    £315.25
    Average lead time: 23 days
    Down
    Up
Filters

4 products available

You've viewed 4 of 4 products

PRICE & AVAILABILITY: Please note that while we are working closely with our suppliers to minimise any global supply chain issues, prices and availability may be subject to change at short notice.
FILTERS
VIEW PRODUCTS Cancel