PELCO LatticeAx 120
A scribeless cleaving instrument with fine, adjustable control of the indentation action on the sample surface.
A scribeless cleaving instrument with fine, adjustable control of the indentation action on the sample surface.
The PELCO LatticeAx 120 base system comprises a scribeless cleaving instrument with fine, adjustable control of the indentation action on the sample surface, followed by a precision-controlled 3-point cleaving step for the production of a high-quality cleaved sample cross-section.
It includes a LatticeAx vacuum stage to secure the sample during the indentation step; a precision, low-profile linear stage to accurately set the indentation position; a pre-installed diamond indenter; and a small vacuum pump with its connection hose.
It is a compact, versatile and powerful cleaving tool for downsizing and cross-sectioning a wide range of substrates including Silicon, GaAs, InP, Sapphire, and Glass. With the PELCO LatticeAx, you can cleave your samples as they are, without additional preparation or strict rules on the size, shape, thickness, edge quality and material type.
The Large Sample Platform is a LatticeAx option that adds support for wafers and samples up to 300mm. It consists of a support system and an indenter extension. The support system includes five underpins made from a Delrin composite that does not damage the backside of the sample. The indenter extension facilitates the fine positioning control of the indenter when large samples are mounted. The Large Sample Platform fits on all models of PELCO LatticeAx systems and is easy to install with a single set screw.