A more advanced sputter coater where the complete sequence of flush, leak, coat and vent is automatically controlled.
All prices exclude VAT.
DescriptionFeatures & specsTech Data
Product Description
A more advanced sputter coater where the complete sequence of flush, leak, coat and vent is automatically controlled. The solenoid operated leak valve allows the gas pressure to return automatically to pre-set conditions. The coater can also be operated in the manual mode if required. The sputter current is set by a digital programmer and is independent of the gas pressure. Sputtering currents up to 40mA allow a range of target materials to be efficiently sputtered by the magnetron head. Coating time can be set, stored and displayed by the digital timer.
Further automation can be achieved with the addition of the terminating film thickness monitor. With this fitted, the desired thickness can be entered and the sputtering process is automatically terminated when this thickness has been reached.
Chamber size AGB7341: 120 x 120mm.
Chamber size AGB7341SE:150 x 165mm.
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Features & Specifications
Sputter head
Low voltage planar magnetron type with quick target change, wrap-around dark-space shield
Sputter target
Gold target ø57 x 0.1mm fitted as standard. Optional targets:
Au/Pd, Pt, Pt/Pd, Ag 57mm dia. x 0.1mm thick, or 57mm dia. x
0.2mm thick
Sputter supply
Programmable digital control, microprocessor-based, safety interlocked, current control independent of vacuum, 10 - 40mA
Sample table
Holds 12 SEM ½” (12.5 mm) stubs delivered as standard, height adjustment through 60mm. R-T stage available for AGB7341, R-T and R-P-T stage available for AGB7341SE
Analogue metering
Vacuum: atmosphere - 0.001mb, Current: 0 - 50mA
Dimensions (W x D x H)
420mm x 295mm x 287 mm
Weight
11kg
Power
45 VA max. (excluding rotary pump)
Pumping system speed
3.0/3.6m3/hr (50/60Hz). Pump downtime to 0.1mb is 20/25 sec
Benchtop system
Vacuum pump is mounted on benchtop compatible anti-vibration table with stainless steel bellows coupling system
Pumping system dimensions (W x D x H)
330mm x 215mm x 210mm (270mm with filter) x
210 mm
AGB7341SE 150mm (5.9”) dia x 165mm (6.5") to 250mm (9.8")
Sputter target
Gold target ø 57 x 0.1mm fitted as standard.
Optional targets: Au/Pd, Pt, Pt/Pd, Ag 57mm dia. x 0.1mm thick, or 57mm dia. x 0.2mm thick
Sample table
Holds 12 SEM ½” (12.5 mm) stubs delivered as standard, height adjustment through 60mm. R-T stage available for AGB7341, R-T and R-P-T stage available for AGB7341SE
Sputter supply
Programmable digital control, microprocessor-based
Safety interlocked
Current control independent of vacuum, 10 - 40mA
Sputter head
Low voltage planar magnetron type with quick target change
Wrap-around dark-space shield
Analogue metering
Vacuum: atmosphere - 0.001mb
Current: 0 - 50mA
Control method
Automatic operation of gas purge and leak functions
Automatic process sequencing
Full manual override
Digital timer (0-300 sec) with pause
Automatic vent
Dimensions
420mm Wide x 295mm Deep x 287mm Height
Weight
11kg
Power consumption
45 VA max. (excluding rotary pump)
Pumping System
Rotary pump
High speed, direct drive, 2 stage
Pumping speed
3.0/3.6m3/hr (50/60Hz)
Pump downtime to 0.1Mb is 20/25 sec
Benchtop system
The vacuum pump is mounted on a benchtop compatible anti-vibration table with stainless steel bellows coupling system
Dimensions
330mm Wide x 215mm Deep x 210mm (270mm with filter) x Height 210mm
Weight
15kg
Power consumption
130 VA
Services required
Supply
100 – 120 or 200 – 240 VAC, 50/60Hz (specify on order)
Power
175VA max.
Argon Gas
Purity min. 99.9%
Pressure: regulated 7 – 8 psi (0.5 – 0.6 bar)
Hose connection: 6.0mm (1/4”)
Thickness Monitors (optional)
General specification
4 digit display, push-button zero
6MHz crystal with lifetime check
10/sec update rate
Thickness range
MINUS 99.9nm to 999.9nm
Resolution
Better than 0.1nm
Density range
0.50-30.00gm/cm3
Tooling factor range:
0.25-8.0
Crystal check
Lifetime display, 0.0 to 999.9kHz shift
Parameter setting
Non-volatile parameter memory with automatic acceleration of scrolling rate
Data change facility
2 source memory (e.g. Au sputter and C evaporation)
LEAD TIMES: Average Lead Times are shown individually in days for any products not currently in stock. Whilst we are working closely with our suppliers to minimise the impact of global supply chain issues, and regularly update our product prices and lead times, some are subject to change due to supply chain fluctuations.
Delivery is calculated at the checkout, please see our delivery and returns page for more information.
PRICE & AVAILABILITY: Please note that while we are working closely with our suppliers to minimise any global supply chain issues, prices and availability may be subject to change at short notice.