Omniprobe lift-out grids are specifically designed to accept TEM lamellae milled by FIB or SEM/FIB systems. The grids are 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an un-obscured view of each section. All grids are 3mm diameter.
Beryllium half-ring lift-out grids. Pack of 10 AGJ425Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.Average lead time: 24 daysPOA
Average lead time: 24 days
3 post lift-out grids3 post lift-out grids designed for in situ lift-out.Average lead time: 1 to 15 daysPOA
Average lead time: 1 to 15 days
4 post lift-out grids4 post lift-out grids designed for in situ lift-out.Average lead time: 24 to 39 daysPOA
Average lead time: 24 to 39 days
5 post lift-out grids, copper. Box of 100 AGJ4225 post copper lift-out grids are suitable for in situ lift-out. CopperAverage lead time: 24 daysPOA
Average lead time: 24 days
