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Pelco Equipment
PELCO FlipScribe

PELCO FlipScribe

Precision backside scribing for all materials.

All prices exclude VAT.

Description Features & specs Tech Data

Name & Code

Grouped product items
Code & Description	Availability	Price	Qty
AG54330 PELCO FlipScribe Back-Side Scribing Tool Loading...	Loading...	POA	POA
AG54331 PELCO FlipScribe Extension for Scribing Large Samples Loading...	Loading...	POA	POA
AG54332 PELCO FlipScribe Holder for Small Samples from 5-25mm, 200-800 microns in thickness Loading...	Loading...	POA	POA
AG54333 PELCO FlipScribe Kit for Sample Holding Loading...	Loading...	POA	POA
AG54334 PELCO FlipScribe Sample Holder for 2" Wafers Loading...	Loading...	POA	POA
AG54335 PELCO FlipScribe Sample Holder for 3" Wafers Loading...	Loading...	POA	POA
AG54336 PELCO FlipScribe Sample Holder for 4" Wafers Loading...	Loading...	POA	POA
AG54338 PELCO FlipScribe Replacement Scribe in Cartridge Loading...	Loading...	POA	POA

Product Description

The PELCO Flip Scribe takes scribing to a new performance level, making clean, straight scribe lines on the backside to allow the user to accurately cleave front side targets, bonded wafers, glass, sapphire and other substrates. It integrates a robust diamond scribe into a sample platform with a fence guide design. The time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualised either by eye or with a user-supplied high magnification microscope.

The PELCO FlipScribe also offers a quick method for cleanly downsizing large area samples, by the use of a "scribe stop" which allows the operator to define the length of the scribe.

The PELCO FlipScribe is a compact, stable, accurate, fast and low-cost scribing and cleaving solution suitable for any lab; no utilities are required for its operation.

Features & Specifications

Enables accurate cleaving through front side targets with a scribe made on the back side of the substrate

Avoids damaging the front side of the sample

Achieves an accuracy of ±200μm

Maintains a flexibility with respect to sample size and shape

Allows the length of the scribe to be varied from 1 to 100mm

Enables precise and repeatable sample alignment and sizing with a ruler embedded in platform

Retains a capability of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving

Technical Data

Operation

The sample is placed face-up on the bed of the PELCO FlipScribe, with the left rail being used to set the position of the scribe and being locked in place. The depth and angle of the scriber tip are adjustable, with the optimal depth and angle depending on the sample type. The stop is set to prevent the blue bar from impacting the sample, and the sample is drawn over the scriber tip to make the scribe. A variety of sample holders are available with many form factors including standard wafer sizes, down to individual small dies. After scribing, the cleave is made using cleaving pliers.

Delivery & Returns

PRICE & AVAILABILITY: Please note that while we are working closely with our suppliers to minimise any global supply chain issues, prices and availability may be subject to change at short notice.