PELCO FlexScribe
Precision topside scribing for all materials.
Precision topside scribing for all materials.
The PELCO FlexScribe is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This system is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5mm up to 200mm wafers for the AG54340 model, and up to 300mm wafers for the AG54342 model.
The standard tungsten carbide cutter installed on the PELCO FlexScribe is great for a wide variety of samples including silicon, glass, GaAs and other crystalline materials. Diamond and deep-cutting scribing wheels are also available.
Break down wafers |
Cleave Strips and dies |
Cleave off crystal access |
Cleave Glass and Sapphire |
Cut coupons for section cleaving |
Cleave irregular shapes |