Pelco Equipment

The PELCO Tripod Polisher 590 can be used to prepare a sample for both SEM and TEM cross-sectional analysis. Special prices valid while stocks last. 

The PELCO Tripod Polisher 590 can be used to prepare a sample for both SEM and TEM cross-sectional analysis. This starter kit includes a variety of accessories.

Replacement and optional accessories for use with the PELCO tripod polisher. 

Precision polishing system for TEM specimen thinning and site-specific analysis.

Accessories and tools for use with the PELCO Dimpler. 

The Pelco Precision Wire Saw is designed for precision cutting for delicate samples. 

Accessories for use with the PELCO Precision Wire Saw.

The PELCO® Precision Low Speed Saw is a compact, multipurpose, precision saw designed to cut a wide variety of materials with minimal subsurface damage.

Accessories for use with the PELCO Precision Low Speed Saw.

A scribeless cleaving instrument with fine, adjustable control of the indentation action on the sample surface.

The PELCO LatticeAx 225 can deliver 20μm positional accuracy with high quality cleaved surfaces in approximately 5 minutes for a trained operator.

The Pelco LatticeAx 420 provides the highest level of accuracy and performance in the LatticeAx Indent and Cleaving System model range.

The Small Sample Cleaver uses a novel sample holder and a cleaving platform to safely cleave samples into chips as small as 2 x 2mm.

Precision backside scribing for all materials. 

Precision topside scribing for all materials. 

Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. Can be used with Buehler, Struers, Allied and many others. Special prices valid while stocks last. 

Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. Can be used with Buehler, Struers, Allied and many others.

Designed for use with all 1/2" Arbor Precision Cut-Off Saws. 3" diameter blades are fully sintered, 4" and higher are metal-bonded.

Designed for use with all 1/2" Arbor Precision Cubic Boron Nitride (cBN) Cut-Off Saws. 3" diameter blades are fully sintered, 4" and higher are metal-bonded.

Silicon Carbide and Aluminium Oxide Abrasive Blades. Designed for use with all 1/2" Arbor Precision Cut-Off Saws.

Wire saws are used for demanding applications where high precision, low damage, and thicker sections are cut. They are common for TEM sample preparation, single-crystal cutting, sectioning, wafering, and similar applications. These blades are small loop wire blades, with a circumference...

Cutting fluids assist in cooling the sample and disc during cutting operation.

Dressing sticks to expose the cutting diamonds, improve cutting rate and reduce heating at the cutting edge. For use with diamond blades or Silicon Carbide. 

BioWave Pro+ is a sophisticated microwave tissue processing system enabling rapid specimen processing with consistent high quality results.