Agar Scientific's new diamond wire saw with digital control delivers the high performance demanded by today's leading laboratories. Equipped with three dimension digital control this saw has been designed to be easy to use and deliver precision cutting at a competitive price.The saw is the perfect tool for cutting/dicing/slicing all kinds of materials up to 50mm thickness, especially for fragile crystals and TEM or IC sample, brittle crystals, ceramics, TEM samples, and even soft plastic samples and can produce very thin slices with minimum surface structure modification.
Key Features
- Sample up to 50mm thickness
- Designed to provide a smooth and precise cutting for many kinds of materials. Ideal cutting tool for material research, TEM sample preparation, and IC failure analysis
- Feed speed possible to be set from 0.01mm/min to 20mm/min
- X and Y axes automatically controlled by touch panel
- Water recirculating pump is included for cooling diamond wire during cutting
- CE certified
Optional orders
- For slicing or dicing very brittle crystal, you may order 0.22mm dia. Diamond Wire. Note that 0.22mm dia. Wire is very easy to broken, please reduce feeding rate to minimum.
- For longer wire life, please use Lube Cool -150 Smart Soild Lubricant and Coolant
- Where improved lighting is required, please consider a Fibre Optic Y-shape Dual Light Microscope Illuminator
