Omniprobe lift-out grids offer secure mounting of TEM lamellae milled by FIB or SEM/FIB systems. The grids are typically 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an unobscured view of each section. All grids are 3mm in diameter.
- FIB Lift Out Grids - CopperLift-out TEM grids for FIB applications. Manufactured by Agar Scientific.Average lead time: 1 to 24 days
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Average lead time: 1 to 24 days - Carb-N-Grids - Carbon FIB Lift Out GridsTwo styles of pure carbon FIB lift-out grids: 2 wide posts or 2 narrow and 2 wide posts. Special prices valid while stocks last.Average lead time: 1 day
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Average lead time: 1 day - FIB Lift-Out Grids, pack of 25 AGJ460These are half-grid lift-out TEM sample holders for FIB applications, made of copper/beryllium. Special prices valid while stocks last.In Stock
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In Stock 
Beryllium half-ring lift-out grids. Pack of 10 AGJ425Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.Average lead time: 24 daysPOA
Average lead time: 24 days
3 post lift-out grids3 post lift-out grids designed for in situ lift-out.Average lead time: 1 to 15 daysPOA
Average lead time: 1 to 15 days
4 post lift-out grids4 post lift-out grids designed for in situ lift-out.Average lead time: 24 to 39 daysPOA
Average lead time: 24 to 39 days
5 post lift-out grids, copper. Box of 100 AGJ4225 post copper lift-out grids are suitable for in situ lift-out. CopperAverage lead time: 24 daysPOA
Average lead time: 24 days
